●The machine body is coated with aluminium alloy; X/Y table are precision linear guide rails;
driven by SERVO motor,has both the auto soldering and mounting function; embeded with industrial
computer system, touch screen interface with both Chinese and English menu, PLC control;
adopts high-precision K-type thermocouple&close cycle control, with PID auto setting system.
●Profile analysis, setting and amendment can be carried out at any time, mass memory for
temperature parameters and heating alignment parameters saving.
●Use adjustable high definition CCD color optical system with functions of split vision,
zoom - in and micro-adjustment, equipped with aberration?detection device; with auto focus
and software operation function,27X optical zoom and 270X digital zoom; zoom control can be
carried out on touch screen.
●Be provided with software functions, including "IC hold", profile suspending or time-lapse,
screen lock etc. which makes the opertion more human-friendly.
●Both upper and lower hot-air heating head are movable on the IR preheating area to fit for
reworking BGA in different positions on PCB.
●Lower heater is mixed heating system with hot-air and IR; leave nitrogen port;
finish the BGA rework process under the nitrogen protection, have special function for saving
nitrogen to save cost.
●Built-in vacuum pump; 360° rotation in Φ angle; mounting nozzle is micro-adjustable;
Suction nozzle can identify material and mounting height automatically, and can control the air
pressure within a small range.
●With function of over-heating protection and air lost protection; upper heater is of
anti-collision and anti-press function.
●Large IR area heater from the bottom will heat the PCB evenly to avoid deformation and keep
soldering effect; heating board is independently controlled;suitable for any kind of BGA package,
including CCGA,BGA,QFN,CSP,LGA,Micro SMD,MLF(Micro Lead Frames)